Home / Platform
Photonic integration moved from the wafer fab to the packaging line
Monolithic integration promises a lot on paper but limits yield and reliability in production. The cantilever platform keeps lasers and silicon separate until a standard flip‑chip step joins them.
The cantilever bond, side view
A III‑V laser die is flipped onto a silicon interposer. A thick silicon waveguide on a cantilever meets the laser output and holds alignment while the bond is made.
Source laser dies
DFB dies come from several qualified foundries. Any III‑V material system can be used.
Bond at an OSAT
Standard high-speed flip-chip tools place each die. No specialised alignment equipment is needed.
Align passively
The cantilever waveguide holds alignment below 200 nm, so there is no active alignment step per laser.
Test quickly
Devices can be tested in a rapid, straightforward flow before they leave the line.
What changes on the factory floor
Figures published by Photon Bridge for the cantilever platform.
Faster bonding
Flip-chip at production speed instead of slow active alignment.
Larger waveguide
Thick silicon waveguides handle more than 1 W of optical power.
Lower wavelength variation
Passive devices work with little or no active tuning, which saves power, complexity and cost.
Unlimited optical I/Os, any material
Because alignment is set by the cantilever and not by each placement, a device can carry as many optical inputs and outputs as the design needs.
The same flow accepts different III‑V materials, which opens the platform to lidar and spectral sensing as well as data centre links.
Packaging partner or foundry?
Photon Bridge works with outside chipmakers and assembly partners rather than its own fab. Get in touch to discuss the flow.